Devices, memory devices, and electronic systems

ABSTRACT

A semiconductor device comprises a stack structure comprising decks each comprising a memory element level comprising memory elements, and a control logic level in electrical communication with the memory element level and comprising control logic devices. At least one of the control logic devices of the control logic level of one or more of the decks comprises at least one device exhibiting transistors laterally displaced from one another. A memory device, a thin film transistor control logic assembly, an electronic system, and a method of operating a semiconductor device are also described.

CROSS-REFERENCE TO RELATED APPLICATION

This application is a continuation of U.S. patent application Ser. No.16/443,628, filed Jun. 17, 2019, now U.S. Pat. No. 10,643,991, issuedMay 5, 2020, which is a continuation of application Ser. No. 15/858,229,filed Dec. 29, 2017, now U.S. Pat. No. 10,340,267, issued Jul. 2, 2019,the disclosure of each of which is hereby incorporated herein in itsentirety by this reference.

TECHNICAL FIELD

Embodiments of the disclosure relate to the field of semiconductordevice design and fabrication. More specifically, embodiments of thepresent disclosure relate to semiconductor devices including stackstructures having control logic levels in decks thereof, and to relatedmemory devices, control logic assemblies, electronic systems, andmethods of operating a semiconductor device.

BACKGROUND

Semiconductor device designers often desire to increase the level ofintegration or density of features within a semiconductor device byreducing the dimensions of the individual features and by reducing theseparation distance between neighboring features. In addition,semiconductor device designers often desire to design architectures thatare not only compact, but offer performance advantages, as well assimplified designs.

One example of a semiconductor device is a memory device. Memory devicesare generally provided as internal integrated circuits in computers orother electronic devices. There are many types of memory including, butnot limited to, random-access memory (RAM), read-only memory (ROM),dynamic random access memory (DRAM), synchronous dynamic random accessmemory (SDRAM), Flash memory, and resistance variable memory.Non-limiting examples of resistance variable memory include resistiverandom access memory (ReRAM), conductive bridge random access memory(conductive bridge RAM), magnetic random access memory (MRAM), phasechange material (PCM) memory, phase change random access memory (PCRAM),spin-torque-transfer random access memory (STTRAM), oxygen vacancy-basedmemory, and programmable conductor memory.

A typical memory cell of a memory device includes one access device,such as a transistor, and one memory storage structure, such as acapacitor. Modern applications for semiconductor devices can employsignificant quantities of memory cells, arranged in memory arraysexhibiting rows and columns of the memory cells. The memory cells may beelectrically accessed through digit lines (e.g., bit lines) and wordlines (e.g., access lines) arranged along the rows and columns of thememory cells of the memory arrays. Memory arrays can be two-dimensional(2D) so as to exhibit a single deck (e.g., a single tier, a singlelevel) of the memory cells, or can be three-dimensional (3D) so as toexhibit multiple decks (e.g., multiple levels, multiple tiers) of thememory cells.

Control logic devices within a base control logic structure underlying amemory array of a memory device have been used to control operations(e.g., access operations, read operations, write operations) on thememory cells of the memory device. An assembly of the control logicdevices may be provided in electrical communication with the memorycells of the memory array by way of routing and interconnect structures.However, as the number of decks of a 3D memory array increases,electrically connecting the memory cells of the different decks of the3D memory array to the assembly of control logic devices within the basecontrol logic structure can create sizing and spacing complicationsassociated with the increased quantities and dimensions of routing andinterconnect structures required to facilitate the electricalconnection. In addition, the quantities, dimensions, and arrangements ofthe different control logic devices employed within the base controllogic structure can also undesirably impede reductions to the size of amemory device, increases to the storage density of the memory device,and/or reductions in fabrication costs.

It would, therefore, be desirable to have improved semiconductordevices, control logic assemblies, and control logic devicesfacilitating higher packing densities, as well as methods of forming thesemiconductor devices, control logic assemblies, and control logicdevices.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a simplified side elevation view of a semiconductor device, inaccordance with embodiments of the disclosure.

FIG. 2 is a block diagram of a thin film transistor (TFT) control logiclevel of the semiconductor device shown in FIG. 1, in accordance withembodiments of the disclosure.

FIGS. 3A through 3C are a simplified cross-sectional views of differentCMOS inverters including vertical transistors laterally displaced fromone another, in accordance with embodiments of the disclosure.

FIG. 4A through 4C are a simplified cross-sectional view of differentCMOS inverters including horizontal transistors laterally displaced fromone another, in accordance with additional embodiments of thedisclosure.

FIG. 5 is simplified cross-sectional view of a CMOS inverter includingFinFETs laterally displaced from one another, in accordance with furtherembodiments of the disclosure.

FIG. 6 is a schematic block diagram illustrating an electronic system,in accordance with embodiments of the disclosure.

DETAILED DESCRIPTION

Semiconductor devices including stack structures having control logiclevels in decks thereof are described, as are memory devices, controllogic assemblies, electronic systems, and methods of operating asemiconductor device. In some embodiments, a semiconductor deviceincludes a stack structure including multiple decks (e.g., tiers) eachindividually including a control logic level (e.g., a TFT control logiclevel), an access device level on or over the control logic level, and amemory element level on or over the access device level. The controllogic level of each individual deck of the stack structure is inelectrical communication with the access device level and the memoryelement level of the individual deck. The control logic level of eachindividual deck of the stack structure may also be in electricalcommunication with a base control logic structure of the semiconductordevice. The control logic level of each of the decks of the stackstructure includes control logic devices and circuitry for controllingdifferent operations of the memory element level and the access devicelevel associated therewith. The control logic devices and circuitryincluded in the control logic level of each of the decks of the stackstructure are different than additional control logic devices andcircuitry included in the base control logic structure of thesemiconductor device. The additional control logic devices and circuitryincluded in the base control logic structure work in conjunction withthe control logic devices and circuitry included in the control logiclevel of each of the decks of the stack structure to facilitate desiredoperations (e.g., access operations, read operations, write operations)of the semiconductor device. In addition, the control logic devicesincluded in the control logic level of at least one deck of the stackstructure include at least one device including transistors (e.g.,vertical transistors, horizontal transistors, fin field-effecttransistors (FinFETs)) laterally (e.g., horizontally) displaced (e.g.,spaced apart, separated) from one another. The devices, structures,assemblies, systems, and methods of the disclosure may facilitateincreased efficiency, performance, simplicity, and durability insemiconductor devices (e.g., 3D memory devices) that rely on highpacking density.

The following description provides specific details, such as materialtypes, material thicknesses, and processing conditions in order toprovide a thorough description of embodiments of the disclosure.However, a person of ordinary skill in the art will understand that theembodiments of the disclosure may be practiced without employing thesespecific details. Indeed, the embodiments of the disclosure may bepracticed in conjunction with conventional fabrication techniquesemployed in the industry. In addition, the description provided belowdoes not form a complete process flow for manufacturing a semiconductordevice (e.g., a memory device). The semiconductor device structuresdescribed below do not form a complete semiconductor device. Only thoseprocess acts and structures necessary to understand the embodiments ofthe disclosure are described in detail below. Additional acts to formthe complete semiconductor device from the semiconductor devicestructures may be performed by conventional fabrication techniques. Alsonote, any drawings accompanying the application are for illustrativepurposes only, and are thus not drawn to scale. Additionally, elementscommon between figures may retain the same numerical designation.

As used herein, the term “configured” refers to a size, shape, materialcomposition, material distribution, orientation, and arrangement of oneor more of at least one structure and at least one apparatusfacilitating operation of one or more of the structure and the apparatusin a predetermined way.

As used herein, the singular forms “a,” “an,” and “the” are intended toinclude the plural forms as well, unless the context clearly indicatesotherwise.

As used herein, “and/or” includes any and all combinations of one ormore of the associated listed items.

As used herein, the terms “longitudinal,” “vertical,” “lateral,” and“horizontal” are in reference to a major plane of a substrate (e.g.,base material, base structure, base construction, etc.) in or on whichone or more structures and/or features are formed and are notnecessarily defined by earth's gravitational field. A “lateral” or“horizontal” direction is a direction that is substantially parallel tothe major plane of the substrate, while a “longitudinal” or “vertical”direction is a direction that is substantially perpendicular to themajor plane of the substrate. The major plane of the substrate isdefined by a surface of the substrate having a relatively large areacompared to other surfaces of the substrate.

As used herein, spatially relative terms, such as “beneath,” “below,”“lower,” “bottom,” “above,” “upper,” “top,” “front,” “rear,” “left,”“right,” and the like, may be used for ease of description to describeone element's or feature's relationship to another element(s) orfeature(s) as illustrated in the figures. Unless otherwise specified,the spatially relative terms are intended to encompass differentorientations of the materials in addition to the orientation depicted inthe figures. For example, if materials in the figures are inverted,elements described as “below” or “beneath” or “under” or “on bottom of”other elements or features would then be oriented “above” or “on top of”the other elements or features. Thus, the term “below” can encompassboth an orientation of above and below, depending on the context inwhich the term is used, which will be evident to one of ordinary skillin the art. The materials may be otherwise oriented (e.g., rotated 90degrees, inverted, flipped, etc.) and the spatially relative descriptorsused herein interpreted accordingly.

As used herein, the term “substantially” in reference to a givenparameter, property, or condition means and includes to a degree thatone of ordinary skill in the art would understand that the givenparameter, property, or condition is met with a degree of variance, suchas within acceptable manufacturing tolerances. By way of example,depending on the particular parameter, property, or condition that issubstantially met, the parameter, property, or condition may be at least90.0% met, at least 95.0% met, at least 99.0% met, at least 99.9% met,or even 100.0% met.

As used herein, the term “about” in reference to a given parameter isinclusive of the stated value and has the meaning dictated by thecontext (e.g., it includes the degree of error associated withmeasurement of the given parameter).

As used herein, the term “NMOS” transistor means and includes aso-called metal-oxide transistor having a P-type channel region. Thegate of the NMOS transistor may comprise a conductive metal, anotherconductive material, such as polysilicon, or a combination thereof. Asused herein, the term “PMOS” transistor means and includes a so-calledmetal-oxide transistor having an N-type channel region. The gate of thePMOS transistor may comprise a conductive metal, another conductivematerial, such as polysilicon, or a combination thereof. Accordingly,the gate structures of such transistors may include conductive materialsthat are not necessarily metals.

FIG. 1 shows a simplified side elevation view of a semiconductor device100 (e.g., a 3D memory device), in accordance with embodiments of thedisclosure. As shown in FIG. 1, the semiconductor device 100 includes abase control logic structure 102, and a stack structure 103 overlyingthe base control logic structure 102. As described in further detailbelow, the stack structure 103 includes decks 104 (e.g., tiers) eachindividually including a thin film transistor (TFT) control logic level,an access device level over the TFT control logic level, a memoryelement level over the access device level, and interconnect structuresextending between the TFT control logic level and each of the accessdevice level and the memory element level. Each TFT control logic levelof the decks 104 may individually include one or more control logicdevices (e.g., CMOS devices) exhibiting neighboring, laterally displacedtransistors (e.g., NMOS transistors, PMOS transistors), as alsodescribed in further detail below. The base control logic structure 102is in electrical communication with one or more (e.g., each) of thedecks 104 of the stack structure 103 by way of interconnect structures112 extending between the base control logic structure 102 and one ormore levels (e.g., the TFT control logic level) of the one or more decks104 of the stack structure 103.

The base control logic structure 102 may include devices and circuitryfor controlling various operations of the stack structure 103. Thedevices and circuitry included in the base control logic structure 102may be selected relative to devices and circuitry included in the TFTcontrol logic levels of the decks 104 of the stack structure 103. Thedevices and circuitry included in the base control logic structure 102may be different than the devices and circuitry included in the TFTcontrol logic levels of the decks 104 of the stack structure 103, andmay be used and shared by different decks 104 of the stack structure 103to facilitate desired operation of the stack structure 103. By way ofnon-limiting example, the base control logic structure 102 may includeone or more (e.g., each) of charge pumps (e.g., V_(CCP) charge pumps,V_(NEGWL) charge pumps, DVC2 charge pumps), delay-locked loop (DLL)circuitry (e.g., ring oscillators), drain supply voltage (V_(dd))regulators, and various chip/deck control circuitry. The devices andcircuitry included in the base control logic structure 102 may employdifferent conventional CMOS devices (e.g., conventional CMOS inverters,conventional CMOS NAND gates, conventional CMOS transmission pass gates,etc.), which are not described in detail herein. In turn, as describedin further detail below, the devices and circuitry included in the TFTcontrol logic level of each of the decks 104 of the stack structure 103may not be shared by different decks 104 of the stack structure 103, andmay be dedicated to effectuating and controlling various operations(e.g., access device level operations, and memory element leveloperations) of the deck 104 associated therewith not encompassed withinthe functions of the devices and circuitry included in the base controllogic structure 102.

With continued reference to FIG. 1, the stack structure 103 may includeany desired number of the decks 104. For clarity and ease ofunderstanding of the drawings and related description, FIG. 1 shows thestack structure 103 as including three (3) decks 104. A first deck 106may include a first TFT control logic level 106A, a first access devicelevel 106B on or over the first TFT control logic level 106A, a firstmemory element level 106C on or over the first access device level 106B,and first interconnect structures 106D extending between andelectrically coupling the first TFT control logic level 106A to each ofthe first access device level 106B and the first memory element level106C. A second deck 108 may overlie the first deck 106 and may include asecond TFT control logic level 108A, a second access device level 108Bon or over the second TFT control logic level 108A, a second memoryelement level 108C on or over the second access device level 108B, andsecond interconnect structures 108D extending between and electricallycoupling the second TFT control logic level 108A to each of the secondaccess device level 108B and the second memory element level 108C. Athird deck 110 may overlie the second deck 108 and may include a thirdTFT control logic level 110A, a third access device level 110B on orover the third TFT control logic level 110A, a third memory elementlevel 110C on or over the third access device level 110B, and thirdinterconnect structures 110D extending between and electrically couplingthe third TFT control logic level 110A to each of the third accessdevice level 110B and the third memory element level 110C. In additionalembodiments, the stack structure 103 includes a different number ofdecks 104. For example, the stack structure 103 may include greater thanthree (3) decks 104 (e.g., greater than or equal to four (4) decks 104,greater than or equal to eight (8) decks 104, greater than or equal tosixteen (16) decks 104, greater than or equal to thirty-two (32) decks104, greater than or equal to sixty-four (64) decks 104), or may includeless than three (3) decks 104 (e.g., two (2) decks 104).

The memory element levels (e.g., the first memory element level 106C,the second memory element level 108C, the third memory element level110C) of the each of the decks 104 (e.g., the first deck 106, the seconddeck 108, the third deck 110) of the stack structure 103 may eachindividually include an array of memory elements. The array may, forexample, include rows of the memory elements extending in a firstlateral direction, and columns of the memory elements extending in asecond lateral direction perpendicular to the first lateral direction.In additional embodiments, the array may include a different arrangementof the memory elements, such as hexagonal close packed arrangement ofthe memory elements. The memory elements of the array may comprise RAMelements, ROM elements, DRAM elements, SDRAM elements, Flash memoryelements, resistance variable memory elements, or another type of memoryelement. In some embodiments, the memory elements comprise DRAMelements. In additional embodiments, the memory elements compriseresistance variable memory elements. Non-limiting examples of resistancevariable memory elements include ReRAM elements, conductive bridge RAMelements, MRAM elements, PCM memory elements, PCRAM elements, STTRAMelements, oxygen vacancy-based memory elements, and programmableconductor memory elements.

The access device levels (e.g., the first access device level 106B, thesecond access device level 108B, the third access device level 110B) ofthe each of the decks 104 (e.g., the first deck 106, the second deck108, the third deck 110) of the stack structure 103 may eachindividually include an array of access devices (e.g., TFT accessdevices). The access devices of the access device level (e.g., the firstaccess device level 106B, the second access device level 108B, the thirdaccess device level 110B) of a given deck 104 (e.g., the first deck 106,the second deck 108, the third deck 110) may be operatively associatedwith the memory elements of the memory element level (e.g., the firstmemory element level 106C, the second memory element level 108C, thethird memory element level 110C) of the given deck 104. The quantity andlateral positioning of the access devices of the access device level ofthe given deck 104 may, for example, correspond to the quantity andlateral positioning of the memory elements of the memory element levelof the given deck 104. The access devices of the access device level mayunderlie (or overlie) and be in electrical communication with the memoryelements of the memory element level. Together the access devices of theaccess device level and the memory elements of the memory element leveloperatively associated therewith may form memory cells for each of thedecks 104 of the stack structure 103. The access devices may, forexample, each individually include a channel region between a pair ofsource/drain regions, and a gate configured to electrically connect thesource/drain regions to one another through the channel region. Theaccess devices may comprise planar access devices (e.g., planar TFTaccess devices) or vertical access devices (e.g., vertical TFT accessdevices). Planar access devices can be distinguished from verticalaccess devices based upon the direction of current flow between thesource and drain regions thereof. Current flow between the source anddrain regions of a vertical access device is primarily substantiallyorthogonal (e.g., perpendicular) to a primary (e.g., major) surface of asubstrate or base (e.g., the base control logic structure 102)thereunder, and current flow between source and drain regions of aplanar access device is primarily parallel to the primary surface of thesubstrate or base thereunder. In additional embodiments, the accessdevice levels (e.g., the first access device level 106B, the secondaccess device level 108B, the third access device level 110B) areomitted (e.g., absent) from the decks 104 (e.g., the first deck 106, thesecond deck 108, the third deck 110) of the stack structure 103. Forexample, in place of the access device levels separate from the memoryelement levels (e.g., the first memory element level 106C, the secondmemory element level 108C, the third memory element level 110C), each ofthe decks 104 of the stack structure 103 may include a single (e.g.,only one) level including memory elements and access devices.

The TFT control logic levels (e.g., the first TFT control logic level106A, the second TFT control logic level 108A, the third TFT controllogic level 110A) of the each of the decks 104 (e.g., the first deck106, the second deck 108, the third deck 110) of the stack structure 103may include devices and circuitry for controlling various operations ofthe memory element level (e.g., the first memory element level 106C, thesecond memory element level 108C, the third memory element level 110C)and the access device level (e.g., the first access device level 106B,the second access device level 108B, the third access device level 110B)(or of a single level including memory elements and access devices) ofthe deck 104 not encompassed (e.g., effectuated, carried out, covered)by the devices and circuitry of the base control logic structure 102. Byway of non-limiting example, the TFT control logic levels may eachindividually include one or more (e.g., each) of decoders (e.g., localdeck decoders, column decoders, row decoders), sense amplifiers (e.g.,equalization (EQ) amplifiers, isolation (ISO) amplifiers, NMOS senseamplifiers (NSAs), PMOS sense amplifiers (PSAs)), word line (WL)drivers, repair circuitry (e.g., column repair circuitry, row repaircircuitry), I/O devices (e.g., local I/O devices), test devices, arraymultiplexers (MUX), error checking and correction (ECC) devices, andself-refresh/wear leveling devices. As described in further detailbelow, the devices and circuitry included in the TFT control logiclevels may employ TFT CMOS devices including laterally displacedtransistors (e.g., PMOS transistors, NMOS transistors). The devices andcircuitry of the TFT control logic level of each of the decks 104 mayonly be utilized to effectuate and control operations within a single(e.g., only one) deck 104 of the stack structure 103 (e.g., may not beshared between two or more of the decks 104), or may be utilized toeffectuate and control operations within multiple (e.g., more than one)decks 104 of the stack structure 103 (e.g., may be shared between two ormore of the decks 104). In addition, each of the TFT control logiclevels (e.g., the first TFT control logic level 106A, the second TFTcontrol logic level 108A, and the third TFT control logic level 110A) ofthe stack structure 103 may exhibit substantially the same configuration(e.g., substantially the same components and component arrangements), orat least one of the TFT control logic levels of the stack structure 103may exhibit a different configuration (e.g., different components and/ora different component arrangement) than at least one other of the TFTcontrol logic levels.

Thus, a semiconductor device according to embodiments of the disclosurecomprises a stack structure comprising decks each comprising a memoryelement level comprising memory elements, and a control logic level inelectrical communication with the memory element level and comprisingcontrol logic devices. At least one of the control logic devices of thecontrol logic level of one or more of the decks comprises at least oneleast one device exhibiting transistors laterally displaced from oneanother.

FIG. 2 is a block diagram of a configuration of a TFT control logiclevel 200 for use in one or more of the decks 104 (FIG. 1) of the stackstructure 103 (FIG. 1) of the semiconductor device 100 shown in FIG. 1.The TFT control logic level 200 may include a variety of control logicdevices and circuits that would otherwise be included in off-deckcircuitry (e.g., circuitry not presented within the TFT control logiclevel 200), such as circuitry within a base control logic structure(e.g., the base control logic structure 102 shown in FIG. 1). Forexample, as shown in FIG. 2, an assembly of control logic devices andcircuits present within the TFT control logic level 200 may include oneor more (e.g., each) of a local deck decoder 202, multiplexers (MUX) 204(illustrated in FIG. 2 as a first MUX 204 a, second MUX 204 b, and athird MUX 204 c), a column decoder 206, a row decoder 208, senseamplifiers 210, local I/O devices 212, word line (WL) drivers 214, acolumn repair device 216, a row repair device 218, a memory test device222, an ECC device 220, and a self-refresh/wear leveling device 224. Oneor more of the control logic devices and circuits may exhibitlaterally-displaced transistors (e.g., laterally-displaced verticaltransistors, laterally-displaced horizontal transistors,laterally-displaced FinFETs), as described in further detail below. Theassembly of control logic devices and circuits present within the TFTcontrol logic level 200 may be operatively associated with (e.g., inelectrical communication with) off-deck devices 236 (e.g., a controller,a host, global I/O devices) located outside of the TFT control logiclevel 200, such as within the base control logic structure 102 shown inFIG. 1. The off-deck devices 236 may send a variety of signals to theTFT control logic level 200, such as a deck enable signal 226, a rowaddress signal 230, a column address signal 232, a global clock signal234; and may also receive a variety of signals from the TFT controllogic level 200, such as a global data signal 228. While FIG. 2 depictsa particular configuration of the TFT control logic level 200, one ofordinary skill in the art will appreciate that different control logicassembly configurations, including different control logic devices andcircuits and/or different arrangements of control logic devices andcircuits, are known in the art which may be adapted to be employed inembodiments of the disclosure. FIG. 2 illustrates just one non-limitingexample of the TFT control logic level 200.

Thus, in accordance with embodiments of the disclosure, a method ofoperating a semiconductor device comprises controlling functions of astack structure having multiple decks each comprising memory cells usingcontrol logic levels of the multiple decks. The control logic levelseach comprise at least one control logic device exhibitinglaterally-displaced transistors. Additional functions of the stackstructure are controlled using a base control logic structure inelectrical communication with the control logic levels of the stackstructure.

As shown in FIG. 2, one or more off-deck devices 236 located outside ofthe TFT control logic level 200 (e.g., in the base control logicstructure 102 shown in FIG. 1) may be configured and operated to conveysignals (e.g., a deck enable signal 226, a row address signal 230, acolumn address signal 232) to different devices of the TFT control logiclevel 200. For example, the off-deck devices 236 may send a deck enablesignal 226 to the local deck decoder 202, which may decode the deckenable signal 226 and activate one or more of the MUX 204 (e.g., thefirst MUX 204 a, the second MUX 204 b, and/or the third MUX 204 c) ofthe TFT control logic level 200. As described in further detail below,when activated, the MUX 204 may individually be configured and operatedto select one of several input signals and then forward the selectedinput into a single line.

The local deck decoder 202 of the TFT control logic level 200 may beconfigured and operated to receive activation (e.g., trigger) signalsfrom a deck enable signal 226 and communicate with the off-deck devices236 to generate control signals, which are then directed to one or moreof the MUX 204 (e.g., the first MUX 204 a, the second MUX 204 b, and/orthe third MUX 204 c) of the TFT control logic level 200 to activateand/or deactivate the one or more of the MUX 204. When activated, theMUX 204 may individually be configured and operated to select one ofseveral input signals, and then forward the selected input into a singleline.

The first MUX 204 a (e.g., a row MUX) of the TFT control logic level 200may be in electrical communication with the local deck decoder 202 andthe row decoder 208 of the TFT control logic level 200. The first MUX204 a may be activated by signal(s) from the local deck decoder 202, andmay be configured and operated to selectively forward at least one rowaddress signal 230 from the off-deck devices 236 to the row decoder 208.The row decoder 208 may be configured and operated to select particularword lines of a deck (e.g., one of the first deck 106, the second deck108, and the third deck 110 shown in FIG. 1) including the TFT controllogic level 200 based on the row address signal 230 received thereby.

With continued reference to FIG. 2, the row repair device 218 of the TFTcontrol logic level 200 may be in electrical communication with the rowdecoder 208, and may be configured and operated to substitute adefective row of memory elements of a memory element array of a memoryelement level (e.g., one of the memory element levels 106C, 108C, 110Cshown in FIG. 1) operatively associated with (e.g., within the same deck104 shown in FIG. 1) the TFT control logic level 200 for a spare,non-defective row of memory elements of the memory element array of thememory element level. The row repair device 218 may transform a rowaddress signal 230 directed to the row decoder 208 (e.g., from the firstMUX 204 a) identifying the defective row of memory elements into anotherrow address signal identifying the spare, non-defective row of memoryelements. Defective rows (and columns) of memory elements may, forexample, be determined using the memory test device 222 of the TFTcontrol logic level 200, as described in further detail below.

The WL drivers 214 of the TFT control logic level 200 may be inelectrical communication with the row decoder 208, and may be configuredand operated to activate word lines of a deck (e.g., one of the firstdeck 106, the second deck 108, and the third deck 110 shown in FIG. 1)including the TFT control logic level 200 based on word line selectioncommands received from the row decoder 208. The memory elements of amemory element level (e.g., one of the memory element levels 106C, 108C,110C shown in FIG. 1) operatively associated with the TFT control logiclevel 200 may be accessed by way of access devices of an access devicelevel (e.g., one of the access device levels 106B, 108B, 110B shown inFIG. 1) operatively associated with the TFT control logic level 200 forreading or programming by voltages placed on the word lines using the WLdrivers 214.

The self-refresh/wear leveling device 224 of the TFT control logic level200 may be in electrical communication with the row decoder 208, and maybe configured and operated to periodically recharge the data stored inmemory elements of a memory element level (e.g., one of the memoryelement levels 106C, 108C, 110C shown in FIG. 1) operatively associatedwith (e.g., within the same deck 104 shown in FIG. 1) the TFT controllogic level 200. During a self-refresh/wear leveling operation, theself-refresh/wear leveling device 224 may be activated in response to anexternal command signal, and may generate different row address signalsthat may be forwarded to the row decoder 208. The row decoder 208 maythen select particular word lines of a deck (e.g., one of the first deck106, the second deck 108, and the third deck 110 shown in FIG. 1)including the TFT control logic level 200 based on the different rowaddress signals received from the self-refresh/wear leveling device 224.The row decoder 208 may then communicate with the WL drivers 214 toactivate the selected word lines, and charges accumulated in capacitorsof memory elements operatively associated with the selected word linesmay then be amplified by a sense amplifier and then stored in thecapacitors again.

Still referring to FIG. 2, the second MUX 204 b (e.g., a column MUX) ofthe TFT control logic level 200 may be in electrical communication withthe local deck decoder 202 and the column decoder 206 of the TFT controllogic level 200. The second MUX 204 b may be activated by signal(s) fromthe local deck decoder 202, and may be configured and operated toselectively forward at least one column address signal 232 from theoff-deck devices 236 to the column decoder 206. The column decoder 206may be configured and operated to select particular digit lines (e.g.,bit lines) of a deck (e.g., one of the first deck 106, the second deck108, and the third deck 110 shown in FIG. 1) including the TFT controllogic level 200 based on the column address selection signal receivedthereby.

The column repair device 216 of the TFT control logic level 200 may bein electrical communication with the column decoder 206, and may beconfigured and operated to substitute a defective column of memoryelements of a memory element array of a memory element level (e.g., oneof the memory element levels 106C, 108C, 110C shown in FIG. 1)operatively associated with (e.g., within the same deck 104 shown inFIG. 1) the TFT control logic level 200 for a spare, non-defectivecolumn of memory elements of the memory element array of the memoryelement level. The column repair device 216 may transform a columnaddress signal 232 directed to the column decoder 206 (e.g., from thesecond MUX 204 b) identifying the defective column of memory elementsinto another column address signal identifying the spare, non-defectivecolumn of memory elements. As previously discussed, defective columns(and rows) of memory elements may, for example, be determined using thememory test device 222 of the TFT control logic level 200, as describedin further detail below.

The ECC device 220 of the TFT control logic level 200 may be configuredand operated to generate an ECC code (also known as “check bits”). TheECC code may correspond to a particular data value, and may be storedalong with the data value in a memory element of a memory element level(e.g., one of the memory element levels 106C, 108C, 110C shown inFIG. 1) operatively associated with (e.g., within the same deck 104shown in FIG. 1) the TFT control logic level 200. When the data value isread back from the memory element, another ECC code is generated andcompared with the previously-generated ECC code to access the memoryelement. If non-zero, the difference in the previously-generated ECCcode and the newly-generated ECC code indicates that an error hasoccurred. If an error condition is detected, the ECC device 220 may thenbe utilized to correct the erroneous data.

The memory test device 222 of the TFT control logic level 200 may beconfigured and operated to identify defective (e.g., faulty) memoryelements of a memory element array of a memory element level (e.g., oneof the memory element levels 106C, 108C, 110C shown in FIG. 1)operatively associated with (e.g., within the same deck 104 shown inFIG. 1) the TFT control logic level 200. The memory test device 222 mayattempt to access and write test data to memory elements at differentaddresses (e.g., different column addresses, different row addresses)within the memory element array. The memory test device 222 may thenattempt to read data stored at the memory elements, and compare the readdata to the test data expected at the memory elements. If the read datais different than the expected test data, the memory test device 222 mayidentify the memory elements as defective. The defective memory elements(e.g., defective rows of memory elements, defective columns of memoryelements) identified by the memory test device 222 may then be actedupon and/or avoided by other components (e.g., the row repair device218, the column repair device 216) of the TFT control logic level 200.

With continued reference to FIG. 2, the local I/O devices 212 of the TFTcontrol logic level 200 may be configured and operated to receive datafrom digit lines selected by the column decoder 206 during readoperations, and to output data to digit lines selected by the columndecoder 206 during write operations. As shown in FIG. 2, the local I/Odevices 212 may include sense amplifiers 210 configured and operated toreceive digit line inputs from the digit lines selected by the columndecoder 206 and to generate digital data values during read operations.During write operations, the local I/O devices 212 may program data intomemory elements of a memory element level operatively associated withthe TFT control logic level 200 by placing proper voltages on the digitlines selected by the column decoder 206. For binary operation, onevoltage level is typically placed on a digit line to represent a binary“1” and another voltage level to represent a binary “0”.

The third MUX 204 c of the TFT control logic level 200 may be inelectrical communication with the local I/O devices 212 and the localdeck decoder 202. The third MUX 204 c may be activated by signal(s)received from the local deck decoder 202, and may be configured andoperated to receive digital data values generated by the local I/Odevices 212 and to generate a global data signal 228 therefrom. Theglobal data signal 228 may be forwarded to one or more off-deck devices236 (e.g., a controller).

In accordance with embodiments of the disclosure, one or more of thecomponents (e.g., one or more of the local deck decoder 202, the MUX 204(the first MUX 204 a, the second MUX 204 b, the third MUX 204 c), thecolumn decoder 206, the row decoder 208, the sense amplifiers 210, thelocal I/O devices 212, the WL drivers 214, the column repair device 216,the row repair device 218, the ECC device 220, the memory test device222, the self-refresh/wear leveling device 224) of the TFT control logiclevel 200 may employ one or more TFT CMOS devices includinghorizontally-neighboring transistors (e.g., horizontally-neighboringNMOS and PMOS transistors) thereof. The horizontally-neighboringtransistors may comprise vertical transistors (e.g., vertical NMOStransistor(s), vertical PMOS transistor(s)) exhibiting channelsvertically extending between vertically-displaced source and drainregions, or may comprise horizontal transistors (e.g., horizontal NMOStransistor(s), horizontal PMOS transistor(s)) exhibiting channelshorizontally extending between horizontally displaced source and drainregions Accordingly, one or more components of at least one of the TFTcontrol logic levels (e.g., the first TFT control logic level 106A, thesecond TFT control logic level 108A, the third TFT control logic level110A) of one or more of the decks 104 (e.g., the first deck 106, thesecond deck 108, the third deck 110) of the stack structure 103 of thesemiconductor device 100 previously described with reference to FIG. 1may include one or more TFT CMOS devices including at least one NMOStransistor (e.g., a vertical NMOS transistor, a horizontal NMOStransistor, an NMOS fin field-effect transistor (FinFET))horizontally-neighboring at least one PMOS transistor (e.g., a verticalPMOS transistor, a horizontal PMOS transistor, a PMOS FinFET).Non-limiting examples of such TFT CMOS devices are described in furtherdetail below with reference to FIGS. 3A through 5.

Thus, a thin film transistor control logic assembly according toembodiments of the disclosure comprises control logic devices selectedfrom the group comprising decoders, sense amplifiers, word line drivers,repair devices, memory test devices, multiplexers, error checking andcorrection devices, and self-refresh/wear leveling devices. At least oneof the control logic devices comprises at least one device exhibiting atransistor having an N-type channel region laterally displaced from atransistor having a P-type channel region.

FIG. 3A shows a simplified cross-sectional view of a CMOS inverter 300,in accordance with embodiments of the disclosure. The CMOS inverter 300includes a CMOS circuit 302 comprising a vertical NMOS transistor 304,and a vertical PMOS transistor 306 horizontally displaced from thevertical NMOS transistor 304. The vertical NMOS transistor 304 includesa first semiconductive pillar 308 including an N-type source region308A, an N-type drain region 308C, and a P-type channel region 308Bvertically between the N-type source region 308A and the N-type drainregion 308C. The vertical PMOS transistor 306 includes a secondsemiconductive pillar 310 including a P-type source region 310A, aP-type drain region 310C, and an N-type channel region 310B verticallybetween the P-type source region 310A and the P-type drain region 310C.The vertical NMOS transistor 304 and the vertical PMOS transistor 306 ofthe CMOS circuit 302 also include gate electrodes 312 horizontallyadjacent the respective channel regions (e.g., the P-type channel region308B, the N-type channel region 310B) thereof. In addition, the CMOSinverter 300 includes a ground (GND) structure 314 connected to theN-type source region 308A of the vertical NMOS transistor 304; a supplyvoltage (V_(cc)) structure 316 connected to the P-type source region310A of vertical PMOS transistor 306; an output structure 318 connectedto the N-type drain region 308C of the vertical NMOS transistor 304 andthe P-type drain region 310C of the vertical PMOS transistor 306; and aninput structure connected to each of the gate electrodes 312.

The gate electrodes 312 may each individually be formed of and includeelectrically conductive material including, but not limited to, a metal(e.g., tungsten, titanium, nickel, platinum, gold), a metal alloy, ametal-containing material (e.g., metal nitrides, metal silicides, metalcarbides, metal oxides), a conductively-doped semiconductor material(e.g., conductively-doped silicon, conductively-doped germanium,conductively-doped silicon germanium, etc.), or combinations thereof. Byway of non-limiting example, the gate electrodes 312 may eachindividually comprise at least one of titanium nitride (TiN), tantalumnitride (TaN), tungsten nitride (WN), titanium aluminum nitride (TiAlN),elemental titanium (Ti), elemental platinum (Pt), elemental rhodium(Rh), elemental aluminum (Al), elemental copper (Cu), elemental iridium(Ir), iridium oxide (IrO_(x)), elemental ruthenium (Ru), ruthenium oxide(RuO_(x)), alloys thereof, or combinations thereof. In some embodiments,the gate electrodes 312 are formed of TiN.

As shown in FIG. 3A, the vertical NMOS transistor 304 may include one ofthe gate electrodes 312 laterally adjacent a side of the P-type channelregion 308B thereof opposing another side laterally adjacent another ofthe gate electrodes 312; and the vertical PMOS transistor 306 mayinclude an additional one of the gate electrodes 312 laterally adjacenta side of the N-type channel region 310B opposing another side laterallyadjacent yet another of the gate electrodes 312. The gate electrodes 312may be unshared by the vertical NMOS transistor 304 and the verticalPMOS transistor 306. Each of the vertical NMOS transistor 304 and thevertical PMOS transistor 306 may be considered to be “double-gated” inthat two of the gate electrodes 312 are disposed laterally adjacent twoopposing sides of the P-type channel region 308B of the vertical NMOStransistor 304; and two other of the gate electrodes 312 are disposedlaterally adjacent two opposing sides of the N-type channel region 310Bof the vertical PMOS transistor 306.

In additional embodiments, one or more of the vertical NMOS transistor304 and the vertical PMOS transistor 306 of the CMOS circuit 302exhibit(s) a different gate configurations than that depicted in FIG.3A. At least one (e.g., each) of the vertical NMOS transistor 304 andthe vertical PMOS transistor 306 may, for example, exhibit a gateconfiguration other than a “double-gate” configuration. As anon-limiting example, in accordance with additional embodiments of thedisclosure, FIG. 3B shows a simplified cross-sectional view of the CMOSinverter 300, wherein the vertical NMOS transistor 304 and the verticalPMOS transistor 306 of the CMOS circuit 302 each exhibit a “single-gate”configuration. As shown in FIG. 3B, only one gate electrode 312′ may bedisposed laterally adjacent the P-type channel region 308B of thevertical NMOS transistor 304; and only one other gate electrode 312′ maybe disposed laterally adjacent the N-type channel region 310B of thevertical PMOS transistor 306. Put another way, only one side of theP-type channel region 308B of the vertical NMOS transistor 304 may havea gate electrode 312′ laterally adjacent thereto; and only one side ofthe N-type channel region 310B of the vertical PMOS transistor 306 mayhave a gate electrode 312′ laterally adjacent thereto. The gateelectrodes 312′ may have material compositions substantially similar tothose previously described with respect to the gate electrodes 312 (FIG.3A). As another non-limiting example, in accordance with futureembodiments of the disclosure, FIG. 3C shows a simplifiedcross-sectional view of the CMOS inverter 300, wherein the vertical NMOStransistor 304 and the vertical PMOS transistor 306 of the CMOS circuit302 each exhibit a “gate-all-around” configuration. One gate electrode312″ may substantially laterally surround all sides of the P-typechannel region 308B (e.g., four sides if the P-type channel region 308Bexhibits a rectangular cross-sectional shape) of the vertical NMOStransistor 304; and another gate electrode 312″ may substantiallylaterally surround all sides of the N-type channel region 310B (e.g.,four sides if the N-type channel region 310B exhibits a rectangularcross-sectional shape) of the vertical PMOS transistor 306. The gateelectrodes 312″ may have material compositions substantially similar tothose previously described with respect to the gate electrodes 312 (FIG.3A).

With returned reference to FIG. 3A, the P-type channel region 308B ofthe vertical NMOS transistor 304 may be formed of and include at leastone P-type conductivity material. The P-type conductivity material may,for example, comprise polysilicon doped with at least one P-type dopant(e.g., boron ions). The P-type channel region 308B of the vertical NMOStransistor 304 may comprise a solid P-type conductivity materialsubstantially completely filling the entire volume thereof; or theP-type channel region 308B of the vertical NMOS transistor 304 mayinclude an opening (e.g., a hollow, a void, a space) extending throughthe P-type conductivity material thereof, such that the P-type channelregion 308B exhibits a “hollow-channel” configuration. In addition, theN-type source region 308A and the N-type drain region 308C of thevertical NMOS transistor 304 may each individually be formed of andinclude at least one N-type conductivity material. The N-typeconductivity material may, for example, comprise polysilicon doped withat least one N-type dopant (e.g., arsenic ions, phosphorous ions,antimony ions). The first semiconductive pillar 308 including the N-typesource region 308A, the P-type channel region 308B, and the N-type drainregion 308C may exhibit any desired dimensions (e.g., channel width,channel thickness, channel length) and shape (e.g., a rectangular columnshape, a cylindrical column shape, a combination thereof). By way ofnon-limiting example, a channel thickness (laterally extending in theX-direction) of the first semiconductive pillar 308 may be within arange of from about 10 nanometers (nm) to about 50 nm, a channel width(laterally extending perpendicular to the channel thickness) of thefirst semiconductive pillar 308 may be within a range of from 20 nm toabout 200 nm, and a channel length (vertically extending in theZ-direction) of the first semiconductive pillar 308 may be within arange of from about 50 nm to about 200 nm.

The N-type channel region 310B of the vertical PMOS transistor 306 maybe formed of and include at least one N-type conductivity material. TheN-type conductivity material may, for example, comprise polysilicondoped with at least one N-type dopant (e.g., arsenic ions, phosphorousions, antimony ions). The N-type channel region 310B of the verticalPMOS transistor 306 may comprise a solid N-type conductivity materialsubstantially completely filling the entire volume thereof; or theN-type channel region 310B of the vertical PMOS transistor 306 mayinclude an opening (e.g., a hollow, a void, a space) extending throughthe N-type conductivity material thereof, such that the N-type channelregion 310B exhibits a “hollow-channel” configuration. In addition, theP-type source region 310A and the P-type drain region 310C of thevertical PMOS transistor 306 may each individually be formed of andinclude at least one P-type conductivity material. The P-typeconductivity material may, for example, comprise polysilicon doped withat least one P-type dopant (e.g., boron ions). The second semiconductivepillar 310 including the P-type source region 310A, the N-type channelregion 310B, and the P-type drain region 310C may exhibit any desireddimensions (e.g., channel width, channel thickness, channel length) andshape (e.g., a rectangular column shape, a cylindrical column shape, acombination thereof). By way of non-limiting example, a channelthickness (laterally extending in the X-direction) of the secondsemiconductive pillar 310 may be within a range of from about 10nanometers (nm) to about 50 nm, a channel width (laterally extendingperpendicular to the channel thickness) of the second semiconductivepillar 310 may be within a range of from 20 nm to about 200 Jim, and achannel length (vertically extending in the Z-direction) of the secondsemiconductive pillar 310 may be within a range of from about 50 nm toabout 200 nm. The dimensions of the second semiconductive pillar 310 maybe substantially the same as or different than the dimensions of thefirst semiconductive pillar 308.

The GND structure 314, the V_(cc) structure 316, the output structure318, and the input structure of the CMOS inverter 300 may exhibitconventional configurations (e.g., conventional dimensions, conventionalshapes, conventional conductive material compositions, conventionalmaterial distributions, conventional orientations, conventionalarrangements), which are not described in detail herein.

FIGS. 4A through 5 (including FIGS. 4A, 4B, 4C, and 5) show simplifiedcross-sectional views of additional TFT CMOS devices according toembodiments of the disclosure that may be included in TFT control logiclevels (e.g., the TFT control logic level 200 shown in FIG. 2; one ormore of the first TFT control logic level 106A, the second TFT controllogic level 108A, and the third TFT control logic level 110A shown inFIG. 1) of the disclosure. Throughout FIGS. 4A through 5 and the writtendescription associated therewith, functionally similar features (e.g.,structures) are referred to with similar reference numerals incrementedby 100. To avoid repetition, not all features shown in FIGS. 4A through5 are described in detail herein. Rather, unless described otherwisebelow, throughout FIGS. 4A through 5 (and the written descriptionassociated therewith), a feature designated by a reference numeral thatis a 100 increment of the reference numeral of a previously-describedfeature (whether the previously-described feature is first describedbefore the present paragraph, or is first described after the presentparagraph) will be understood to be substantially similar to thepreviously-described feature.

FIG. 4A shows a simplified cross-sectional view of a CMOS inverter 400,in accordance with additional embodiments of the disclosure. The CMOSinverter 400 includes a CMOS circuit 402 comprising a horizontal NMOStransistor 404, and a horizontal PMOS transistor 406 horizontally (e.g.,laterally) displaced from the horizontal NMOS transistor 404. Thehorizontal NMOS transistor 404 comprises a first semiconductive section408 of a semiconductive structure 401, wherein the first semiconductivesection 408 includes an N-type source region 408A, an N-type drainregion 408C, and a P-type channel region 408B laterally (e.g.,horizontally) between the N-type source region 408A and the N-type drainregion 408C. The horizontal PMOS transistor 406 includes a secondsemiconductive section 410 of the semiconductive structure 401, thesecond semiconductive section 410 including a P-type source region 410A,a P-type drain region 410C, and an N-type channel region 410B laterallybetween the P-type source region 310A and the P-type drain region 310C.The horizontal NMOS transistor 404 and the horizontal PMOS transistor406 of the CMOS circuit 402 also include gate electrodes 412 verticallyadjacent the respective channel regions (e.g., the P-type channel region408B, the N-type channel region 410B) thereof. In addition, the CMOSinverter 400 includes a ground (GND) structure 414 connected to theN-type source region 408A of the horizontal NMOS transistor 404; asupply voltage (V_(cc)) structure 416 connected to the P-type sourceregion 410A of the horizontal PMOS transistor 406; an output structure418 connected to the N-type drain region 408C of the horizontal NMOStransistor 404 and the P-type drain region 410C of the horizontal PMOStransistor 406; and an input structure connected to each of the gateelectrodes 412.

As shown in FIG. 4A, in some embodiments, the gate electrodes 412vertically overlie the P-type channel region 408B of the horizontal NMOStransistor 404 and the N-type channel region 410B of the horizontal PMOStransistor 406, such that the horizontal NMOS transistor 404 and thehorizontal PMOS transistor 406 of the CMOS circuit 402 each exhibit a“top-gate” configuration. In additional embodiments, one or more of thehorizontal NMOS transistor 404 and the horizontal PMOS transistor 406 ofthe CMOS circuit 402 exhibit(s) a different gate configuration than thatdepicted in FIG. 4A. At least one (e.g., each) of the horizontal NMOStransistor 404 and the horizontal PMOS transistor 406 may, for example,exhibit a gate configuration other than a “top-gate” configuration. As anon-limiting example, in accordance with additional embodiments of thedisclosure, FIG. 4B shows a simplified cross-sectional view of the CMOSinverter 400 wherein the horizontal NMOS transistor 404 and thehorizontal PMOS transistor 406 of the CMOS circuit 402 each exhibit a“bottom-gate” configuration. As shown in FIG. 4B, the gate electrodes412 vertically underlie the P-type channel region 408B of the horizontalNMOS transistor 404 and the N-type channel region 410B of the horizontalPMOS transistor 406.

With returned reference to FIG. 4A, the semiconductive structure 401 maybe formed of and include at least one semiconductive material, such asone or more of silicon (e.g., amorphous silicon, polysilicon),silicon-germanium, germanium, gallium arsenide, gallium nitride, andindium phosphide. The horizontal NMOS transistor 404 and the horizontalPMOS transistor 406 may be at least partially (e.g., substantially)located within the semiconductive structure 401. The materialcompositions of the horizontal NMOS transistor 404 (including thematerial compositions of the N-type source region 408A, the N-type drainregion 408C, and the P-type channel region 408B thereof) and thehorizontal PMOS transistor 406 (including the material compositions ofthe P-type source region 410A, the P-type drain region 410C, and theN-type channel region 410B thereof) may respectively be substantiallysimilar to those of the vertical NMOS transistor 304 (including thematerial compositions of the N-type source region 308A, the N-type drainregion 308C, and the P-type channel region 308B thereof) and thevertical PMOS transistor 306 (including the material compositions of theP-type source region 310A, the P-type drain region 310C, and the N-typechannel region 310B thereof) previously described with reference to FIG.3A.

As shown in FIG. 4A, vertical boundaries of the different regions (e.g.,the N-type source region 408A, the N-type drain region 408C, the P-typechannel region 408B) of the horizontal NMOS transistor 404 may besubstantially coplanar with one another; and vertical boundaries of thedifferent regions (e.g., the P-type source region 410A, the P-type drainregion 410C, the N-type channel region 410B) of the horizontal PMOStransistor 406 may also be substantially coplanar with one another. Inadditional embodiments, vertical boundaries of at least one of thedifferent regions (e.g., the P-type channel region 408B) of thehorizontal NMOS transistor 404 may be offset from vertical boundaries ofat least one other of the different regions (the N-type source region408A, the N-type drain region 408C) of the horizontal NMOS transistor404; and/or vertical boundaries of at least one of the different regions(e.g., the N-type channel region 410B) of the horizontal PMOS transistor406 may be offset from vertical boundaries of at least one other of thedifferent regions (the P-type source region 410A, the P-type drainregion 410C) of the horizontal PMOS transistor 406. As a non-limitingexample, in accordance with additional embodiments of the disclosure,FIG. 4C shows a simplified cross-sectional view of the CMOS inverter 400wherein upper vertical boundaries of the P-type channel region 408B ofthe horizontal NMOS transistor 404 are offset from (e.g., verticallyoverlie) upper vertical boundaries of the N-type source region 408A andthe N-type drain region 408C of the horizontal NMOS transistor 404; andwherein upper vertical boundaries of the N-type channel region 410B ofthe horizontal PMOS transistor 406 are offset from (e.g., verticallyoverlie) upper vertical boundaries of the P-type source region 410A andthe P-type drain region 410C of the horizontal PMOS transistor 406. Asshown in FIG. 4C, upper vertical boundaries of the P-type channel region408B of the horizontal NMOS transistor 404 and the N-type channel region410B of the horizontal PMOS transistor 406 may be substantially coplanarwith uppermost vertical boundaries of the semiconductive structure 401;upper vertical boundaries of the N-type source region 408A and theN-type drain region 408C of the horizontal NMOS transistor 404 may beoffset from (e.g., vertically underlie) the uppermost verticalboundaries of the semiconductive structure 401; and upper verticalboundaries of the P-type source region 410A and the P-type drain region410C of the horizontal PMOS transistor 406 may be offset from (e.g.,vertically underlie) the uppermost vertical boundaries of thesemiconductive structure 401.

The GND structure 414, the V_(cc) structure 416, the output structure418, and the input structure of the CMOS inverter 400 may exhibitconventional configurations (e.g., conventional dimensions, conventionalshapes, conventional conductive material compositions, conventionalmaterial distributions, conventional orientations, conventionalarrangements), which are not described in detail herein.

FIG. 5 shows a simplified cross-sectional view of a CMOS inverter 500,in accordance with additional embodiments of the disclosure. The CMOSinverter 500 includes a CMOS circuit 502 comprising a NMOS FinFET 504,and a PMOS FinFET 506 horizontally (e.g., laterally) displaced from theNMOS FinFET 504. The NMOS FinFET 504 comprises a first semiconductivefin 508 including an N-type source region 508A, an N-type drain region508C, and a P-type channel region 508B horizontally between the N-typesource region 508A and the N-type drain region 508C. The PMOS FinFET 506includes a second semiconductive fin 510 including a P-type sourceregion 510A, a P-type drain region 510C, and an N-type channel region510B horizontally between the P-type source region 510A and the P-typedrain region 510C. The NMOS FinFET 504 and the PMOS FinFET 506 of theCMOS circuit 502 also include gate electrodes 512 adjacent (e.g.,vertically adjacent, laterally adjacent) the respective channel regions(e.g., the P-type channel region 508B, the N-type channel region 510B)thereof. The NMOS FinFET 504 and the PMOS FinFET 506 of the CMOSinverter 500 may be located on or over an insulative structure 501. Inaddition, the CMOS inverter 500 includes a ground (GND) structure 514connected to the N-type source region 508A of the NMOS FinFET 504; asupply voltage (V_(cc)) structure 516 connected to the P-type sourceregion 510A of the PMOS FinFET 506; an output structure 518 connected tothe N-type drain region 508C of the NMOS FinFET 504 and the P-type drainregion 510C of the PMOS FinFET 506; and an input structure connected toeach of the gate electrodes 512.

As shown in FIG. 5, one of the gate electrodes 512 may extend overopposing sides (e.g., opposing side surfaces) and a top (e.g., an uppersurface) of the P-type channel region 508B of the first semiconductivefin 508 of the NMOS FinFET 504. In addition, another of the gateelectrodes 512 may extend over opposing sides (e.g., opposing sidesurfaces) and a top (e.g., an upper surface) of the N-type channelregion 510B of the second semiconductive fin 510 of the PMOS FinFET 506.In additional embodiments, one or more (e.g., each) of the NMOS FinFET504 and the PMOS FinFET 506 exhibit(s) a “gate-all-around”configuration. For example, one of the gate electrodes 512 maysubstantially surround the opposing sides, the top, and a bottom of theP-type channel region 508B of the NMOS FinFET 504; and another of thegate electrodes 512 may substantially surround the opposing sides, thetop, and a bottom of the N-type channel region 510B of the PMOS FinFET506. In some such embodiments, the P-type channel region 508B of theNMOS FinFET 504 comprises one or more (e.g., multiple) P-typeconductivity structures, and a conductive material of one of the gateelectrodes 512 substantially surrounds surfaces of the P-typeconductivity structures between the N-type source region 508A and theN-type drain region 508C; and the N-type channel region 510B of the PMOSFinFET 506 comprises one or more (e.g., multiple) N-type conductivitystructures, and a conductive material of another of the gate electrodes512 substantially surrounds surfaces of the N-type conductivitystructures between the P-type source region 510A and the P-type drainregion 510C.

The insulative structure 501, the GND structure 514, the V_(cc)structure 516, the output structure 518, the input structure, and theadditional input structure of the CMOS inverter 500 may exhibitconventional configurations (e.g., conventional dimensions, conventionalshapes, conventional conductive material compositions, conventionalmaterial distributions, conventional orientations, conventionalarrangements), which are not described in detail herein.

While FIGS. 3A through 5 (including FIGS. 3A, 3B, 3C, 4A, 4B, 4C, and 5)show non-limiting examples of different CMOS inverters that may beincluded in one or more components of at least one of the TFT controllogic levels (e.g., the first TFT control logic level 106A, the secondTFT control logic level 108A, the third TFT control logic level 110A) ofone or more of the decks 104 (e.g., the first deck 106, the second deck108, the third deck 110) of the stack structure 103 previously describedwith reference to FIG. 1, one or more components of at least one of theTFT control logic levels may include other devices (e.g., other CMOSdevices) in addition to or in place of the CMOS inverters previouslydescribed with reference to FIGS. 3A through 5. By way of non-limitingexample, one or more components of at least one of the TFT control logiclevels of one or more of the decks 104 (FIG. 1) of the semiconductordevice 100 (FIG. 1) may include one of more of other inverters (e.g.,other CMOS inverters, such as balanced CMOS inverters), transmissionpass gates (e.g., CMOS transmission pass gates, such as balanced CMOStransmission pass gates), ring oscillators, and negative-AND (NAND)gates (e.g., two-input NAND gates, such as balanced two-input NANDgates).

Thus, a memory device in accordance with embodiments of the disclosurecomprises a base control logic structure comprising control logicdevices, and a stack structure in electrical communication with the basecontrol logic structure. The stack structure comprises decks eachcomprising a memory element level comprising memory elements, and acontrol logic level in electrical communication with the memory elementlevel. The control logic level comprises additional control logicdevices selected from the group comprising decoders, sense amplifiers,word line drivers, repair devices, memory test devices, multiplexers,error checking and correction devices, and self-refresh/wear levelingdevices. At least one of the additional control logic devices comprisesa circuit comprising neighboring, laterally-displaced transistors havingdifferent channel conductivities than one another.

Semiconductor devices (e.g., the semiconductor device 100 previousdescribed with reference to FIG. 1) including semiconductor devicestructures (e.g., the stack structure 103 and the base control logicstructure 102 previous described with reference to FIG. 1) in accordancewith embodiments of the disclosure may be used in embodiments ofelectronic systems of the disclosure. For example, FIG. 6 is a blockdiagram of an illustrative electronic system 600 according toembodiments of disclosure. The electronic system 600 may comprise, forexample, a computer or computer hardware component, a server or othernetworking hardware component, a cellular telephone, a digital camera, apersonal digital assistant (PDA), portable media (e.g., music) player, aWi-Fi or cellular-enabled tablet such as, for example, an iPad® orSURFACE® tablet, an electronic book, a navigation device, etc. Theelectronic system 600 includes at least one memory device 602. The atleast one memory device 602 may include, for example, an embodiment of asemiconductor device previously described herein (e.g., semiconductordevice 100 previously previous described with reference to FIG. 1),wherein different decks (e.g., the decks 104) of a stack structure(e.g., the stack structure 103) of the semiconductor device each includea control logic level (e.g., the TFT control logic level 200 previouslydescribed with reference to FIG. 2) comprising an assembly of controllogic devices, at least one of the control logic devices including atleast one device (e.g., a TFT CMOS device) exhibitinglaterally-displaced transistors (e.g., laterally-displaced verticaltransistors, laterally-displaced horizontal transistors,laterally-displaced FinFETs). The electronic system 600 may furtherinclude at least one electronic signal processor device 604 (oftenreferred to as a “microprocessor”). The electronic signal processordevice 604 may, optionally, include an embodiment of a semiconductordevice previously described herein (e.g., semiconductor device 100previously previous described with reference to FIG. 1). The electronicsystem 600 may further include one or more input devices 606 forinputting information into the electronic system 600 by a user, such as,for example, a mouse or other pointing device, a keyboard, a touchpad, abutton, or a control panel. The electronic system 600 may furtherinclude one or more output devices 608 for outputting information (e.g.,visual or audio output) to a user such as, for example, a monitor, adisplay, a printer, an audio output jack, a speaker, etc. In someembodiments, the input device 606 and the output device 608 may comprisea single touchscreen device that can be used both to input informationto the electronic system 600 and to output visual information to a user.The one or more input devices 606 and output devices 608 may communicateelectrically with at least one of the memory device 602 and theelectronic signal processor device 604.

Thus, in accordance with embodiments of the disclosure, an electronicsystem comprises a semiconductor device comprising a stack structure.The stack structure comprises decks each comprising a memory elementlevel comprising memory elements and a control logic level in electricalcommunication with the memory element level and comprising control logicdevices. At least one of the control logic devices of the control logiclevel of one or more of the decks comprises at least one deviceexhibiting laterally-displaced transistors.

The devices, structures, assemblies, systems, and methods of thedisclosure advantageously facilitate improved semiconductor deviceperformance, reduced costs (e.g., manufacturing costs, material costs),increased miniaturization of components, and greater packaging densityas compared to conventional devices, conventional structures,conventional assemblies, conventional systems, and conventional methods.The devices, structures, assemblies, systems, and methods of thedisclosure may also improve performance, scalability, efficiency, andsimplicity as compared to conventional devices, conventional structures,conventional assemblies, conventional systems, and conventional methods.

While the disclosure is susceptible to various modifications andalternative forms, specific embodiments have been shown by way ofexample in the drawings and have been described in detail herein.However, the disclosure is not limited to the particular formsdisclosed. Rather, the disclosure is to cover all modifications,equivalents, and alternatives falling within the scope of the followingappended claims and their legal equivalents.

What is claimed is:
 1. A device, comprising: a control logic levelcomprising control logic devices comprising horizontally neighboringtransistors; memory cells vertically overlying and in electricalcommunication with the control logic devices of the control logic level;an additional control logic level vertically overlying the memory cellsand comprising additional control logic devices comprising additionalhorizontally neighboring transistors; and additional memory cellsvertically overlying and in electrical communication with the additionalcontrol logic devices of the additional control logic level; and a basecontrol logic structure underlying the control logic level andcomprising further control logic devices having different configurationsand operational functions than the control logic devices and theadditional control logic devices, the further control logic devices inelectrical communication with and shared by each of the control logiclevel and the additional control logic level.
 2. The device of claim 1,wherein the control logic devices of the control logic level and theadditional control logic devices of the additional control logic levelcomprise one or more of decoders, sense amplifiers, word line drivers,repair circuitry, I/O devices, test devices, array multiplexers, errorchecking and correction devices, and self-refresh/wear leveling devices.3. The device of claim 1, wherein the further control logic devicescomprise one or more of charge pumps, delay-locked loop circuitry, anddrain supply voltage regulators.
 4. The device of claim 1, wherein thehorizontally neighboring transistors of at least one of the controllogic devices comprise: at least one PMOS transistor; and at least oneNMOS transistor horizontally neighboring the at least one PMOStransistor.
 5. The device of claim 1, wherein: one or more of thecontrol logic devices of the control logic level comprise a CMOScircuit; and one or more of the additional control logic devices of theadditional control logic level comprise an additional CMOS circuit. 6.The device of claim 1, wherein the horizontally neighboring transistorsof at least one of the control logic devices comprise verticaltransistors horizontally neighboring one another.
 7. The device of claim1, wherein the horizontally neighboring transistors of at least one ofthe control logic devices comprise horizontal transistors horizontallyneighboring one another.
 8. The device of claim 1, wherein one or moreof at least one of the horizontally neighboring transistors and at leastone of the additional horizontally neighboring transistors has ahollow-channel configuration.
 9. The device of claim 1, wherein the basecontrol logic structure comprises one or more of a controller, a host,and a global I/O device in electrical communication with and shared byeach of the control logic level and the additional control logic level.10. A device, comprising: a control logic level comprising control logicdevices comprising horizontally neighboring transistors; memory cellsvertically overlying and in electrical communication with the controllogic devices of the control logic level; an additional control logiclevel vertically overlying the memory cells and comprising additionalcontrol logic devices comprising additional horizontally neighboringtransistors; and additional memory cells vertically overlying and inelectrical communication with the additional control logic devices ofthe additional control logic level; wherein one or more of at least oneof the horizontally neighboring transistors and at least one of theadditional horizontally neighboring transistors comprises: a channelthickness in a first horizontal direction within a range of from about10 nm to about 50 nm; a channel width in a second horizontal directionperpendicular to the first horizontal direction within a range of fromabout 20 nm to about 200 nm; and a channel length in a verticaldirection within a range of from about 50 nm to about 200 nm.
 11. Amemory device, comprising: a first array of memory cells, each memorycell of the first array of memory cells individually comprising: a firstmemory element; and a first select device in electrical communicationwith the first memory element; a first control logic level comprisingCMOS circuits in electrical communication with the first array of memorycells; a second array of memory cells overlying the first array ofmemory cells, each memory cell of the second array of memory cellsindividually comprising: a second memory element; and a second selectdevice in electrical communication with the second memory element; and asecond control logic level comprising additional CMOS circuits inelectrical communication with the second array of memory cells; and abase control logic level underlying the first control logic level andcomprising devices configured to provide operational functions for eachof the first array of memory cells, the first control logic level, thesecond array of memory cells, and the second control logic level. 12.The memory device of claim 11, wherein: the first control logic levelunderlies the first array of memory cells; and the second control logiclevel intervenes between the first array of memory cells and the secondarray of memory cells.
 13. The memory device of claim 11, furthercomprising: a third array of memory cells overlying the second array ofmemory cells, each memory cell of the third array of memory cellsindividually comprising: a third memory element; and a third selectdevice in electrical communication with the third memory element; and athird control logic level comprising further CMOS circuits in electricalcommunication with the third array of memory cells.
 14. The memorydevice of claim 13, wherein the third control logic level intervenesbetween the second array of memory cells and the third array of memorycells.
 15. The memory device of claim 11, wherein the CMOS circuits ofthe first control logic level and the additional CMOS circuits of thesecond control logic level comprise transistors each individuallycomprising: a source region; a drain region; a channel region verticallyinterposed between the source region and the drain region; and at leastone conductive gate structure horizontally neighboring the channelregion.
 16. The memory device of claim 11, wherein the CMOS circuits ofthe first control logic level and the additional CMOS circuits of thesecond control logic level comprise transistors each individuallycomprising: a source region; a drain region; a channel regionhorizontally interposed between the source region and the drain region;and at least one conductive gate structure vertically neighboring thechannel region.
 17. The memory device of claim 11, further comprising abase control logic level underlying the first control logic level and inelectrical communication with the first array of memory cells and thesecond array of memory cells.
 18. An electronic system, comprising: aninput device; an output device; a processor device operably coupled tothe input device and the output device; and a memory device operablycoupled to the processor device and comprising a stack structurecomprising: a base control logic structure comprising control logicdevices; a control logic level overlying the base control logicstructure and including CMOS devices in electrical communication withthe control logic devices of the base control logic structure, the CMOSdevices comprising transistors horizontally neighboring one another; anarray of memory cells in electrical communication with the control logiclevel; an additional control logic level overlying the control logiclevel and including additional CMOS devices in electrical communicationwith the control logic devices of the base control logic structure, theadditional CMOS devices comprising additional transistors horizontallyneighboring one another; and an additional array of memory cells inelectrical communication with the additional control logic level.